PHYSICAL PROPERTIES OF COPPER & COPPER BASED ALLOY
Density z
Gms/cm
MELTING POINT
Coefficient of thermal expansion (20-300 °C) X10 per °C
Specific heat
(at 20°C)
Cal/gm/ °C
Thermal conductivity at 20°C Cal/ CM/Sec/ °C
Electrical
conductivity
at 20°C %IACS.
Solidus Temp. °C Liquidus Temp. °C
Electrolytic Cu (ETP) 8.89 - 8.9 1065 1083 17.7 0.092 0.934 101%
DHP Cu 8.94 1065 1083 177.7 0.092 70-87 70-80
DPA Cu 8.94 1065 1082 18 0.092 35-45 35-45
TELLURIUM Cu (0.5 Tel) 8.94 1050 1080 17.8 0.092z 0.88 0.95
70/30 Cartridge Brass 8.53 915 955 19.9 0.090 0.29 0.28
Admiralty Brass 8.53 900 935 20.2 20.2 0.09 0.26 25%
Aluminium Brass 8.33 930 970 18.5 0.090 0.24 23%
70/30 Cu. Ni. 8.94 1100 1150 17.1 0.090 0.11 9%
90/10 Cu. Ni. 8.94 1170 1240 16.2 0.090 0.07 46%